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10-Layer Buried Copper Block Rigid-Flex PCB

10-Layer Buried Copper Block Rigid-Flex PCB

Layers:10L(Buried copper block)
Material:FR-4 HTG+PI(M6+R-F775)
Board Thicknes:2.0mm
Copper Thicknes:35/18/18/35 um
Min.Trace/Space:3/3 mil
Surface Finsh:ENIG
Finger gold-plated 40μ
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14-layer high-speed rigid-flex printed circuit board

14-layer high-speed rigid-flex printed circuit board

Layers:14L
Material:TU-872SLK+PI+TU-872SLK
Board Thicknes:2.8mm
Copper Thicknes:35/18/18/35 um
BGA:0.2MM
Min.Hole Size:0.15mm
Surface Finsh:ENIG
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12-Layer DuPont Material Buried Capacitor and Buried Resistor Flex-Rigid PCB

12-Layer DuPont Material Buried Capacitor and Buried Resistor Flex-Rigid PCB

Layers:12L
Material:FR-4 HTG+PI(TU-883+AP8525R)
Board Thicknes:1.8 mm
Copper Thicknes:35/18/18/35 um
Min.Hole Size:0.1mm
Surface Finsh:ENIG
Control impedance
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10-Layer HDI Structure Rigid-Flex Board

10-Layer HDI Structure Rigid-Flex Board

Layers:10L
Material:FR-4 +PI（Megtron7+PI）
Board Thicknes:1.6mm
Min.Hole Size:0.05mm
Surface Finsh:ENIG
second-order HDI board
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