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| Items | Mass | Sample | |
|---|---|---|---|
| Layers | 2~56L | 108L | |
| Max. Board Thickness | 10mm (394mil) | 14mm (551mil) | |
| Min Width/Space | Inner Layer | 2.2mil/2.2mil | 1.5mil/1.5mil |
| Outer Layer | 2.5/2.5mil | 1.5/1.5mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| Drill | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm (4mil) | 0.050mm (2mil) | |
| Max. Size (Finish Size) | Board | 850mmX570mm | 1000mmX600mm |
| Backplane | 1250mmX570mm | 1320mmX600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 18:1 | 24:1 |
| Impedance tolerance | Line-card | +/-8% | +/-5% |
| Max. Copper Thickness | 6Oz | 300z | |
| HDI | Sructure | Any Layer | Any Layer |
| Min Width/Space | 2.0/2.0mil | 1.5/1.5mil | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Rigid-Flex | Polyimide, Halogen-free, Lead-free, LCP, Tk | ||
| Surface Finish | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||